KOMI Global
Products
Mobile Phones
Laptops & Tablets
Wearable Devices
TM-2000
Heated Prebonding of diecuts
Solutions for prebonding PSA, heat activated/cured & other types of adhesive diecuts and bonding.
Combined with sophisticated fixture for accurate adhesive diecut alignment, different levels of IPX and adhesion strength can be achieved using standard PSA’s and bonding film adhesives. Special waterproof adhesive is not needed.
Efficient design for small machine footprint for cleanroom uses.
APM-100
Diecut Alignment & Prebonding
Accurate & high precision PSA diecuts alignment to Housings/Frames for prebonding. Uniform pressure distribution for optimum PSA wetting.
Manually loaded or auto inline device handling to accurately assemble displays or touch panel display modules to Housings/Frames for optimum PSA adhesion strength.
TM-2000
Heated Prebonding of diecuts
Solutions for prebonding PSA, heat activated/cured & other types of adhesive diecuts and bonding.
Combined with sophisticated fixture for accurate adhesive diecut alignment, different levels of IPX and adhesion strength can be achieved using standard PSA’s and bonding film adhesives. Special waterproof adhesive is not needed.
Efficient design for small machine footprint for cleanroom uses.